Extrinsic transient diffusion in silicon

نویسنده

  • Martin D. Giles
چکیده

The effect of extrinsic background doping on the transient enhancement of dopant diffusion for an ion-implanted dopant is investigated to gain insight into the role of point defect charge states. The transient effect is found to be greatly increased for extrinsic background doping of the same type as the implanted ion, and reduced for background doping of the opposite type. Analysis of the relative enhancements for boron and phosphorous allows the position of the donor and acceptor levels for the silicon self-interstitial to be extracted. The results are in good agreement with earlier work based on extrinsic oxidation-enhanced diffusion.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Silicon self-diffusion under extrinsic conditions

Self-diffusion in silicon is investigated under extrinsic carrier conditions by monitoring the diffusion of Si in isotopically enriched silicon layers with boron and phosphorus background doping. At 1000 °C, we find that the Si self-diffusion coefficient is slightly enhanced in both nand p-type backgrounds. This is direct evidence of the existence of both negatively and positively charged nativ...

متن کامل

Transient phosphorus diffusion from silicon and argon implantation damage

We have investigated transient enhanced diffusion of phosphorus in silicon following implantation with silicon or argon ions at low doses. Both conditions show uphill diffusion of phosphorus due to the defect gradients, but the resulting profiles are quite different because of differences in the initial defect distributions. These experiments support an interstitial pair diffusion mechanism for...

متن کامل

Complete suppression of boron transient-enhanced diffusion and oxidation-enhanced diffusion in silicon using localized substitutional carbon incorporation

In this letter, we show the ability, through introduction of a thin Si12x2yGexCy layer, to eliminate the enhancement of enhanced boron diffusion in silicon due to an oxidizing surface or ion implant damage. This reduction of diffusion is accomplished through a low-temperature-grown thin epitaxial Si12x2yGexCy layer which completely filters out excess interstitials introduced by oxidation or ion...

متن کامل

Diffusion of tin in germanium: a GGA+U approach

Related Articles Computational methodology for analysis of the Soret effect in crystals: Application to hydrogen in palladium J. Appl. Phys. 112, 083516 (2012) Spectroscopic analysis of Al and N diffusion in HfO2 J. Appl. Phys. 112, 064118 (2012) Copper centers in copper-diffused n-type silicon measured by photoluminescence and deep-level transient spectroscopy Appl. Phys. Lett. 101, 042113 (20...

متن کامل

Point defect based modeling of low dose silicon implant damage and oxidation effects on phosphorus and boron diffusion in silicon

Point defect kinetics are important for understanding and modeling dopant diffusion in silicon. This article describes point defect models and compares them with experimental results for intrinsically doped material. Transient dopant diffusion due to low dose silicon implant damage can be modeled with the same parameters as oxidation enhanced diffusion, and therefore provides an additional tech...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 1999